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The European Funds for a Modern Economy 2021-2027 program is a continuation of two previous programs: Innovative Economy 2007-2013 and Smart Growth 2014-2020. Approximately EUR 7.9 billion was allocated to the program. The aim of the program is:
- Supporting the development and increasing the potential in research and innovation, investment and infrastructure, and the use of advanced technologies
- Reaping the benefits of digitalization for citizens, businesses, research organizations and public institutions
- Strengthening the sustainable growth and competitiveness of SMEs and creating jobs in SMEs, including through productive investment
- Developing skills in smart specialization, industrial transformation and entrepreneurship
Long-wavelength cascade detectors for spectroscopy and FSOs
- Duration:
- Overall budget (Consortium), PLN
- Eligible costs (VIGO), PLN:
- Funding rate, PLN:
- Beneficiary:
- 01/01/2024 - 31/12/2026
- 13 958 559,25
- 13 958 559,25
- 9 371 626,00
- VIGO PHOTONICS S.A
- Duration: 01/01/2024 - 31/12/2026
- Overall budget (Consortium), PLN 13 958 559,25
- Eligible costs (VIGO), PLN: 13 958 559,25
- Funding rate, PLN: 9 371 626,00
- Beneficiary: VIGO PHOTONICS S.A
The proposed project envisages the implementation of an R&D module that will include industrial research and development work aimed at developing cascaded infrared detector technology and sensing modules. The result of this project will be new products in the form of a family of sensors: cascade detectors made of III-V materials with an active area made of supergrid-II type, optimized for the long-wave infrared range ≥ 10.6 m operating without cryogenic cooling, and on their basis detection modules, that is, cascade detectors integrated with amplifying and accompanying electronics. These will be:
-Detectors and detection modules with long-wavelength immersion cascade detector for spectroscopy applications.
-Detectors and modules with ≥ 3 GHz bandwidth with long-wavelength immersion cascade detector.
-32 element cascade detector rulers and modules with cascade detector rulers.
These will be new products intended mainly for foreign markets for optoelectronic system manufacturers. The end result of the project will be the development of all stages of cascade detector technology and detector modules so as to put them into production upon completion of the project.
HyperPIC Photonic integrated circuits for mid-infrared applications
- Duration:
- Overall budget (Consortium), PLN:
- Eligible costs (VIGO), PLN:
- Funding rate, PLN
- Beneficiary:
- 01.10.2023 - 31.12.2029
- 1 527 841 462,15
- 878 606 239,96
- 453 694 142,06
- VIGO PHOTONICS S.A
- Duration: 01.10.2023 - 31.12.2029
- Overall budget (Consortium), PLN: 1 527 841 462,15
- Eligible costs (VIGO), PLN: 878 606 239,96
- Funding rate, PLN 453 694 142,06
- Beneficiary: VIGO PHOTONICS S.A
The subject of the project is the definition and implementation of a complete value chain for mid-infrared integrated photonics (MIRPIC) chips, including a set of technologies and infrastructure necessary to undertake large-scale production of MIRPIC chips for applications in miniature sensor systems. The result of the project will be the first foundry in Poland and Europe offering the possibility of manufacturing integrated photonics circuits for the mid-infrared range at high-volume scale.
The main objectives of the project will be achieved through intensive R&D work carried out by VIGO Photonics with the participation of partners with expert competencies in the key areas covered by the project, i.e. mid-IR detector and source technology, PIC waveguide circuits, heterogeneous integration technology and optoelectronic packaging, mass testing techniques and design of basic and composite functional blocks. This work, carried out within the framework of the RDI phase, will allow the definition and development of scalable manufacturing technologies and, consequently, the design of the foundry and individual process lines in their final form, envisaged for implementation within the framework of the First Industrial Deployment (FID) phase.
The individual tasks include the development of individual technologies and, according to the Project Portfolio, focus on:
1) Development of scalable detector technology
2) Development of scalable MIR light source technology
3) Development of scalable passive waveguide technology
4) Development of active and passive component integration technology
5) Development of optoelectronic packaging technology
6) Development of mass testing techniques for photonic integrated circuits
7) Development of process design kit (PDK). After the completion of the RDI phase, two tasks of the industrial implementation phase are planned
8) FID investment phase
9) FID operational phase.
The implementation of HyperPIC technology will allow the replacement of expensive and complex systems with integrated circuits. Consequently, it will be possible to use single chips acting as micro-laboratories in everyday devices (smartphones, home appliances, cars). In addition, it will enable the deployment of distributed sensor networks and monitoring systems for industry, environment, agriculture, traffic and transportation systems, critical infrastructure, etc.
The target group of customers/users of the foundry and recipients of the integrated circuits manufactured at the foundry will be companies operating in the broadly defined sensing market, implementing solutions for applications in areas such as digital health monitoring (in consumer electronics systems), gas and liquid monitoring, automotive industry, modern agriculture, security and telecommunications (in free space). It is also planned to make foundry capabilities available through MPW (multiproject wafer run) cycles for universities, research institutes and SMEs.
The HyperPIC project aims to:
- build a complete infrastructure for manufacturing photonic integrated circuit (PIC) components
- semiconductor light sources and detectors for the MIR range, passive waveguide components on semiconductor substrates in generic technologies,
- build infrastructure for hybrid and heterogeneous integration of the above components and optoelectronic packaging,
- Develop and develop libraries and tools for PIC chip design (PDK),
- develop and implement technologies for mass testing of PIC components and circuits.
