The European Funds for a Modern Economy 2021-2027 program is a continuation of two previous programs: Innovative Economy 2007-2013 and Smart Growth 2014-2020. Approximately EUR 7.9 billion was allocated to the program. The aim of the program is:
- Supporting the development and increasing the potential in research and innovation, investment and infrastructure, and the use of advanced technologies
- Reaping the benefits of digitalization for citizens, businesses, research organizations and public institutions
- Strengthening the sustainable growth and competitiveness of SMEs and creating jobs in SMEs, including through productive investment
- Developing skills in smart specialization, industrial transformation and entrepreneurship
Detectors and integrated detection modules for industrial and medical applications adapted for surface mounting
- Grant Agreement:
- Time:
- Overall budget (Consortium), PLN:
- Qualified Costs, PLN:
- Funding amount (Consortium), PLN:
- Funding amount (VIGO), PLN:
- Consortium:
- FENG.05.01-IP.01-002E/25-00
- 01/04/2025-30/09/2029
- 19 957 302,26
- 17 990 590,34
- 12 082 892,69 PLN
- 12 082 892,69
- Leader: VIGO Photonics S.A. Consortiant: Warsaw Military University of Technology
- Grant Agreement: FENG.05.01-IP.01-002E/25-00
- Time: 01/04/2025-30/09/2029
- Overall budget (Consortium), PLN: 19 957 302,26
- Qualified Costs, PLN: 17 990 590,34
- Funding amount (Consortium), PLN: 12 082 892,69 PLN
- Funding amount (VIGO), PLN: 12 082 892,69
- Consortium: Leader: VIGO Photonics S.A. Consortiant: Warsaw Military University of Technology
The objective of the project titled “ Detectors and integrated detection modules for industrial and medical applications adapted for surface mounting” is to develop a new product family of surface-mount mid-infrared (3–5 µm) sensors: uncooled detectors based on III–V materials, as well as complete detection modules (detector + readout circuitry) utilizing dedicated application-specific integrated circuits (ASICs) that eliminate conventional wire bonding in favor of surface-mount technology (SMT) micro-assembly.
These will comprise:
- Surface-mount detectors and integrated detection modules featuring a detector optimized for a wavelength of 3.3 µm.
- Surface-mount detectors and integrated detection modules featuring a detector optimized for a wavelength of 5.0 µm.
These will be new products targeted primarily at international markets for manufacturers of optoelectronic systems that widely employ automated surface-mount assembly technology. The ultimate deliverable of the project will be the development of all technological stages for this sensor family, enabling their deployment into production at VIGO upon project completion. Currently, commercially available mid-infrared (3–5 µm) detectors and detection modules are predominantly offered in through-hole technology (THT) packages, and products suitable for automated surface-mount assembly still represent a niche in the optoelectronic components market. The widespread use of TO (Transistor Outline) packages as carriers for mid-infrared detector structures significantly limits the potential for further miniaturization of detection systems and, in certain applications, completely precludes the use of such products.
Key Technological Differentiators:
- Lead-Free Soldering Resistance: Detector structures and packages withstand temperatures up to 270°C, enabling automated assembly on standard electronic production lines in a single pass.
- Dedicated ASIC: Integration of the detector chip with a specialized, low-noise readout integrated circuit (ASIC) within a single hermetic ceramic package.
- Radical Miniaturization: The detection module achieves dimensions of just 8 × 8 mm (a volume of 256 mm³) and a mass below 0.5 g, paving the way for high-volume integration into portable devices.
- Eco-Innovation (RoHS): Complete elimination of hazardous substances (mercury, cadmium, and tellurium) in favor of safe III–V semiconductor materials (type-II superlattices, T2SL).
One of the project & key stages involves developing III–V material-based detector structures that entirely eliminate the need for wire bonding, replacing it with direct contact bonding between the structures and standard electrical leads used in electronics. This task requires establishing a bonding technique between the
structures and the substrate (e.g., PCB or ceramic) that avoids damaging the fragile semiconductor structure. It also entails developing a semiconductor device structure resilient to subsequent thermal stress, allowing the entire detector to be soldered using standard lead-free soldering processes. The second key stage is the development of an application-specific integrated circuit (ASIC) optimized for
mid-infrared detectors. Developing such a circuit is critical for the further miniaturization of detection modules, thereby enhancing the commercial accessibility of these products in high-volume markets by reducing both the footprint and unit cost of the final product. A low-noise analog readout circuit is essential for reliable
device performance and the manufacture of high-precision detection modules. Multi-channel capability is incorporated to support the widest possible range of applications and expand overall functionality.
The final stage of the project involves integrating the developed detector structure with the dedicated readout circuit within a single hermetic package. The application potential for mid-infrared optimized detection modules is broad. They can serve as gas analysis systems in industrial processes and food production, air quality monitoring in environmental protection, emission control for harmful and greenhouse gases, non-invasive patient monitoring based on breath analysis in medicine, and safety systems for detecting overheating vehicle running gear or early-stage fire outbreaks.
- Healthcare: Non-invasive medical diagnostics and disease biomarker detection in exhaled breath.
- Industry, Environmental Protection & Consumer Appliances/IoT: Compact sensors for greenhouse gas tracking, air quality monitoring, and food freshness assessment in smart home appliances.
- Automotive & Transport: Fast, contactless temperature measurement, driver monitoring, and early detection of overheating actuators and fire hazards.
This project aligns with the advancement of deep-tech and directly supports Europe technological sovereignty in advanced semiconductors and photonics.
VIGO Photonics on the international stage: strengthening export potential in the USA and the European Union
- Contract No.:
- Project duration:
- Total costs (PLN):
- Eligible costs (PLN):
- Amount of funding (PLN):
- Beneficiary:
- FENG.02.25-IP.02-0188/25
- 07/03/2025 – 30/04/2028
- 2,151,444.27
- 2,077,915.80
- 1,121,811.30
- VIGO Photonics S.A.
- Contract No.: FENG.02.25-IP.02-0188/25
- Project duration: 07/03/2025 – 30/04/2028
- Total costs (PLN): 2,151,444.27
- Eligible costs (PLN): 2,077,915.80
- Amount of funding (PLN): 1,121,811.30
- Beneficiary: VIGO Photonics S.A.
As part of the project, VIGO PHOTONICS S.A. plans to participate as an exhibitor in three prestigious trade fair events, namely SPIE Photonics West in the years 2026–2028, as well as in three outbound economic missions as a visitor:
- SEMICON WEST 2026 – USA
- OFC 2026 – USA
- CEM EMISSION & AIR QUALITY MONITORING 2025 – Slovenia
In addition, the company plans to carry out three comprehensive promotional campaigns in the United States of America, aimed at broadly presenting its technological offering and strengthening its position in one of the world’s key photonics markets. These campaigns will be directly linked to participation in the prestigious SPIE Photonics West trade fairs in 2026–2028 in San Francisco, which are among the most important industry events globally. The project falls within the advanced sector of professional electronics, microelectronics, and photonics, which constitutes a key area of the company’s operations.
The main objective of the project is to increase brand recognition of VIGO Photonics S.A. in the selected markets.
The project also aims to:
- Present the company’s products: infrared detectors, detection modules, and epitaxial wafers.
- Hold meetings with potential partners and clients from the USA and Europe to establish business relationships.
- Promote the brand in foreign markets and build its image as a significant player in the photonics sector.
- Promote the Polish Economy Brand by showcasing innovative Polish technologies.
- Build brand recognition of VIGO PHOTONICS through participation in prestigious industry events.
Expected results:
- Increased brand recognition,
- Acquisition of new customers and partners,
- Sales growth,
- Development of innovation.
The project is co-financed by the Polish Agency for Enterprise Development under the programme European Funds for a Modern Economy, measure: Promotion of the brand of innovative SMEs.
Long-wavelength cascade detectors for spectroscopy and FSOs
- Duration:
- Overall budget (Consortium), PLN
- Eligible costs (VIGO), PLN:
- Funding rate, PLN:
- Beneficiary:
- 01/01/2024 - 31/03/2027
- 13 958 559,25
- 13 958 559,25
- 9 371 626,00
- VIGO PHOTONICS S.A
- Duration: 01/01/2024 - 31/03/2027
- Overall budget (Consortium), PLN 13 958 559,25
- Eligible costs (VIGO), PLN: 13 958 559,25
- Funding rate, PLN: 9 371 626,00
- Beneficiary: VIGO PHOTONICS S.A
The proposed project envisages the implementation of an R&D module that will include industrial research and development work aimed at developing cascaded infrared detector technology and sensing modules. The result of this project will be new products in the form of a family of sensors: cascade detectors made of III-V materials with an active area made of supergrid-II type, optimized for the long-wave infrared range ≥ 10.6 m operating without cryogenic cooling, and on their basis detection modules, that is, cascade detectors integrated with amplifying and accompanying electronics. These will be:
-Detectors and detection modules with long-wavelength immersion cascade detector for spectroscopy applications.
-Detectors and modules with ≥ 3 GHz bandwidth with long-wavelength immersion cascade detector.
-32 element cascade detector rulers and modules with cascade detector rulers.
These will be new products intended mainly for foreign markets for optoelectronic system manufacturers. The end result of the project will be the development of all stages of cascade detector technology and detector modules so as to put them into production upon completion of the project.
HyperPIC Photonic integrated circuits for mid-infrared applications
- Duration:
- Overall budget (Consortium), PLN:
- Eligible costs (VIGO), PLN:
- Funding rate, PLN
- Beneficiary:
- 01.10.2023 - 31.12.2029
- 1 527 841 462,15
- 878 606 239,96
- 453 694 142,06
- VIGO PHOTONICS S.A
- Duration: 01.10.2023 - 31.12.2029
- Overall budget (Consortium), PLN: 1 527 841 462,15
- Eligible costs (VIGO), PLN: 878 606 239,96
- Funding rate, PLN 453 694 142,06
- Beneficiary: VIGO PHOTONICS S.A
The subject of the project is the definition and implementation of a complete value chain for mid-infrared integrated photonics (MIRPIC) chips, including a set of technologies and infrastructure necessary to undertake large-scale production of MIRPIC chips for applications in miniature sensor systems. The result of the project will be the first foundry in Poland and Europe offering the possibility of manufacturing integrated photonics circuits for the mid-infrared range at high-volume scale.
The main objectives of the project will be achieved through intensive R&D work carried out by VIGO Photonics with the participation of partners with expert competencies in the key areas covered by the project, i.e. mid-IR detector and source technology, PIC waveguide circuits, heterogeneous integration technology and optoelectronic packaging, mass testing techniques and design of basic and composite functional blocks. This work, carried out within the framework of the RDI phase, will allow the definition and development of scalable manufacturing technologies and, consequently, the design of the foundry and individual process lines in their final form, envisaged for implementation within the framework of the First Industrial Deployment (FID) phase.
The individual tasks include the development of individual technologies and, according to the Project Portfolio, focus on:
1) Development of scalable detector technology
2) Development of scalable MIR light source technology
3) Development of scalable passive waveguide technology
4) Development of active and passive component integration technology
5) Development of optoelectronic packaging technology
6) Development of mass testing techniques for photonic integrated circuits
7) Development of process design kit (PDK). After the completion of the RDI phase, two tasks of the industrial implementation phase are planned
8) FID investment phase
9) FID operational phase.
The implementation of HyperPIC technology will allow the replacement of expensive and complex systems with integrated circuits. Consequently, it will be possible to use single chips acting as micro-laboratories in everyday devices (smartphones, home appliances, cars). In addition, it will enable the deployment of distributed sensor networks and monitoring systems for industry, environment, agriculture, traffic and transportation systems, critical infrastructure, etc.
The target group of customers/users of the foundry and recipients of the integrated circuits manufactured at the foundry will be companies operating in the broadly defined sensing market, implementing solutions for applications in areas such as digital health monitoring (in consumer electronics systems), gas and liquid monitoring, automotive industry, modern agriculture, security and telecommunications (in free space). It is also planned to make foundry capabilities available through MPW (multiproject wafer run) cycles for universities, research institutes and SMEs.
The HyperPIC project aims to:
- build a complete infrastructure for manufacturing photonic integrated circuit (PIC) components
- semiconductor light sources and detectors for the MIR range, passive waveguide components on semiconductor substrates in generic technologies,
- build infrastructure for hybrid and heterogeneous integration of the above components and optoelectronic packaging,
- Develop and develop libraries and tools for PIC chip design (PDK),
- develop and implement technologies for mass testing of PIC components and circuits.
